Protective Film for Wafer dicing - High Temperature Resistant UV and Residue-Free PET Film

Are you tired of dealing with sticky residue when removing protective film after wafer dicing? Look no further! Introducing our latest product - the Crystal Wafer Dicing Protective Film.

Our protective film is specially designed for various applications, including silicon wafers, tempered glass, electronic components, SMT components, and MLCC chip capacitors. It provides a high level of adhesion when applied to the surface of your products.

Once your processing is complete, simply expose the film to UV light. The protective film will lose its adhesiveness, making it easy to remove without leaving any residue behind. No more sticky mess to clean up!

Some key features of our Crystal Wafer Dicing Protective Film:

• Material: PET (Polyethylene Terephthalate)
• Thickness available: 0.05mm and 0.2mm
• High transparency
• Customizable width and adhesive type
• Length: 100 meters
• Brand: Xin Hong Ke

Whether you are in the semiconductor industry or involved in electronics manufacturing, our protective film is a reliable choice for precise and residue-free dicing and cutting. Its high viscosity ensures excellent bonding, while its UV resistance guarantees durability even in high-temperature environments.

Don't settle for subpar protective films that leave behind sticky residue. Trust the Crystal Wafer Dicing Protective Film for a cleaner and more efficient dicing process!

Contact us now to secure your order and enjoy the benefits of our revolutionary product. Say goodbye to sticky residue and hello to hassle-free dicing!