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High thermal conductivity epoxy resin potting compound with a thermal conductivity of 0.4W-3.0W and high hardness AB epoxy resin sealant

Reference FOB Price / Purchase Qty

$32

≥1

Price Description

The above price does not include logistics prices and tariffs and other costs, the specific transaction price can contact the business to discuss!

Customer service assurance

Lost/wrong item guarantee Quality assurance

Open order

Dongguan Yirongsheng New Materials Co., LTD

Establishment time

Factory area200 m²

Main products

1042487

Company address

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Specifications:

General
Whether to import	no
Brand	Yi Rongsheng
Item number	7
Packaging specifications	Customized
Type of adhesive material	Electronic components
Effective substances ≥	Resin
Shelf life	6
enforce standards	RoHS
Working temperature	40-300 °
Viscosity	Customized on demand
Curing method	Two-component curing
place of origin	Dongguan
Validity period	Six months
Function	Heat conduction, sealing, waterproof, insulating, flame-retardant, moisture-proof
Scope of application	"Electronic"
Special services	Customized on demand
Series	Epoxy resin AB glue
Product item number	YH-8979AB
Order Number	YH-8979AB
Model	Non-standard customization
Product Name	Two-component silicone thermal conductive potting compound
Environmental protection grade	Superior grade
Complete curing time	Six hours
Chemical type	Epoxy resin adhesive
Glue state	Liquid state

Product Description:

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